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INTERNATIONAL PATENT: KYOCERA CORPORATION, 京セラ株式会社 FILES APPLICATION FOR "CUTTING INSERT, CUTTING TOOL AND METHOD FOR MANUFACTURING CUT WORKPIECE"

GENEVA, May 12 -- KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto6128501), 京セラ株式会社 (京都府京都&#... Read More


INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックIPマネジメント株式会社 FILES APPLICATION FOR "MOVING BODY DETECTION SYSTEM, CONTROL SYSTEM, WIRING TOOL AND LOAD SYSTEM"

GENEVA, May 12 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックIPマネ&#1... Read More


INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "DISPLAY DEVICE, METHOD FOR OPERATING DISPLAY DEVICE AND BACKLIGHT"

GENEVA, May 12 -- SONY GROUP CORPORATION (1-7-1, Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#28... Read More


INTERNATIONAL PATENT: SHISEIDO COMPANY, LTD., 株式会社 資生堂 FILES APPLICATION FOR "NEEDLE BEAUTY INSTRUMENT, BEAUTY KIT AND BEAUTY METHOD"

GENEVA, May 12 -- SHISEIDO COMPANY, LTD. (5-5, Ginza 7-chome, Chuo-ku, Tokyo1040061), 株式会社 資生堂 (東京都中央区... Read More


INTERNATIONAL PATENT: NISSAN CHEMICAL CORPORATION, 日産化学株式会社 FILES APPLICATION FOR "CHARGE-TRANSPORTING COMPOSITION"

GENEVA, May 12 -- NISSAN CHEMICAL CORPORATION (5-1, Nihonbashi 2-chome, Chuo-ku, Tokyo1036119), 日産化学株式会社 (東京都中&#2283... Read More


INTERNATIONAL PATENT: TORAY INDUSTRIES, INC., 東レ株式会社 FILES APPLICATION FOR "COLORED RESIN COMPOSITION, COLORED FILM AND COLORED DIVIDING WALL"

GENEVA, May 12 -- TORAY INDUSTRIES, INC. (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038666), 東レ株式会社 (東京都中央区&... Read More


INTERNATIONAL PATENT: THE DOSHISHA, 学校法人同志社 FILES APPLICATION FOR "POLYMER COMPOSITION AND ANTITHROMBOTIC COATING AGENT"

GENEVA, May 12 -- THE DOSHISHA (601, Gembu-cho, Karasuma-Higashi-iru, Imadegawa-dori, Kamigyo-ku, Kyoto-shi, Kyoto6028580), 学校法人同志社 (京都&#... Read More


INTERNATIONAL PATENT: LINTEC CORPORATION, リンテック株式会社 FILES APPLICATION FOR "MARKING DEVICE AND MARKING METHOD AND SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP"

GENEVA, May 12 -- LINTEC CORPORATION (23-23 Honcho, Itabashi-ku, Tokyo1730001), リンテック株式会社 (東京都板橋&#2130... Read More


INTERNATIONAL PATENT: MITSUBISHI HEAVY INDUSTRIES, LTD., 三菱重工業株式会社 FILES APPLICATION FOR "BOOSTER PUMP AND LOW-TEMPERATURE FLUID SUPPLY SYSTEM"

GENEVA, May 12 -- MITSUBISHI HEAVY INDUSTRIES, LTD. (2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo1008332), 三菱重工業株式会社 (東京&#371... Read More


INTERNATIONAL PATENT: TOKURIKI HONTEN CO., LTD., 株式会社徳力本店 FILES APPLICATION FOR "METHOD FOR MANUFACTURING CU-AG ALLOY WIRE MATERIAL, CU-AG ALLOY WIRE MATERIAL MANUFACTURED THEREBY AND PROBE PIN FOR INSPECTING ELECTRIC/ELECTRONIC COMPONENT OBTAINED USING CU-AG ALLOY WIRE MATERIAL"

GENEVA, May 12 -- TOKURIKI HONTEN CO., LTD. (2-9-12, Kaji-cho, Chiyoda-ku, Tokyo1018548), 株式会社徳力本店 (東京都千代&#30... Read More